Invention Grant
- Patent Title: Integrated circuit packaging system with die paddles and method of manufacture thereof
- Patent Title (中): 具有芯片的集成电路封装系统及其制造方法
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Application No.: US12884102Application Date: 2010-09-16
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Publication No.: US08936971B2Publication Date: 2015-01-20
- Inventor: Zigmund Ramirez Camacho , Emmanuel Espiritu , Henry Descalzo Bathan
- Applicant: Zigmund Ramirez Camacho , Emmanuel Espiritu , Henry Descalzo Bathan
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L21/56 ; H01L21/58 ; H01L23/31 ; H01L21/48 ; H01L23/495 ; H01L23/00
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle group having a first package paddle electrically isolated from a second package paddle; attaching an integrated circuit device on the first package paddle and the second package paddle; forming a standoff terminal adjacent the package paddle group and electrically connected to the integrated circuit device; connecting a paddle connector to the integrated circuit device and the first package paddle and another paddle connector to the integrated circuit device and the second package paddle; and forming an encapsulation over the integrated circuit device, the first package paddle, the second package paddle, and the standoff terminal, the encapsulation exposing a portion of the first package paddle, the second package paddle, and the standoff terminal.
Public/Granted literature
- US20120068363A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLES AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2012-03-22
Information query
IPC分类:
