Invention Grant
- Patent Title: Structure and method for topography free SOI integration
- Patent Title (中): 地形自由SOI集成的结构和方法
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Application No.: US12958429Application Date: 2010-12-02
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Publication No.: US08936996B2Publication Date: 2015-01-20
- Inventor: Ravi M. Todi , Joseph Ervin , Chengwen Pei , Geng Wang
- Applicant: Ravi M. Todi , Joseph Ervin , Chengwen Pei , Geng Wang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent H. Daniel Schnurmann
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L29/02 ; H01L21/762

Abstract:
A semiconductor structure is provided that includes a semiconductor oxide layer having features. The semiconductor oxide layer having the features is located between an active semiconductor layer and a handle substrate. The semiconductor structure includes a planarized top surface of the active semiconductor layer such that the semiconductor oxide layer is beneath the planarized top surface. The features within the semiconductor oxide layer are mated with a surface of the active semiconductor layer.
Public/Granted literature
- US20120139085A1 Structure and Method for Topography Free SOI Integration Public/Granted day:2012-06-07
Information query
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