Invention Grant
US08937362B2 Semiconductor device having a reinforcing member for filling a gap between a semiconductor chip and a cover member and manufacturing method for semiconductor device
有权
具有用于填充半导体芯片和盖构件之间的间隙的加强构件的半导体器件和用于半导体器件的制造方法
- Patent Title: Semiconductor device having a reinforcing member for filling a gap between a semiconductor chip and a cover member and manufacturing method for semiconductor device
- Patent Title (中): 具有用于填充半导体芯片和盖构件之间的间隙的加强构件的半导体器件和用于半导体器件的制造方法
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Application No.: US13975578Application Date: 2013-08-26
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Publication No.: US08937362B2Publication Date: 2015-01-20
- Inventor: Takatoshi Igarashi
- Applicant: Olympus Corporation
- Applicant Address: JP Tokyo
- Assignee: Olympus Corporation
- Current Assignee: Olympus Corporation
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2011-044343 20110301
- Main IPC: H01L31/0203
- IPC: H01L31/0203 ; H01L23/16 ; H01L27/146
Abstract:
An image pickup apparatus includes a semiconductor chip including a light receiving section, a frame-like spacer arranged on the semiconductor chip to surround the light receiving section, a transparent flat plate section arranged on the semiconductor chip via the spacer and having a plan view dimension larger than a plan view dimension of the spacer and smaller than a plan view dimension of the semiconductor chip, and a reinforcing member for filling a gap between the semiconductor chip and the transparent flat plate section on the outer side of the spacer and having a plan view dimension larger than the plan view dimension of the transparent flat plate section and smaller than the plan view dimension of the semiconductor chip.
Public/Granted literature
- US20130334643A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE Public/Granted day:2013-12-19
Information query
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