Invention Grant
- Patent Title: Shearing mechanism for cutting through an adhesive bonding of a direct bonding panel
- Patent Title (中): 用于切割直接接合面板的粘合剂的剪切机构
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Application No.: US13724019Application Date: 2012-12-21
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Publication No.: US08937805B2Publication Date: 2015-01-20
- Inventor: Chi-Chou Cheng , Chung Jen Ho , Kai-Yuan Cheng , Min-Cheng Huang
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products, L.P.
- Current Assignee: Dell Products, L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Isidore PLLC
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G02F1/1333

Abstract:
An information handling system display having a first part that includes a display screen and rendering electronics fastened onto a second part to seal the rendering electronics within the display. The first part is bonded onto the second part via an adhesive that forms a bond between the two parts. A shearing mechanism is also disposed within the display with at least one externally exposed end. A pulling force is applied to the at least one externally exposed end in order to cut through the bond when there is a need to separate the two parts from each other.
Public/Granted literature
- US20140177156A1 Shearing Mechanism for Cutting Through an Adhesive Bonding of a Direct Bonding Panel Public/Granted day:2014-06-26
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