Invention Grant
US08937807B2 Circuit board heatsink and heatframe structures with heater element for circuit board operation at below zero temperature
有权
电路板散热器和带有加热元件的加热器结构，用于电路板在低于零温度下运行
- Patent Title: Circuit board heatsink and heatframe structures with heater element for circuit board operation at below zero temperature
- Patent Title (中): 电路板散热器和带有加热元件的加热器结构，用于电路板在低于零温度下运行
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Application No.: US13300871Application Date: 2011-11-21
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Publication No.: US08937807B2Publication Date: 2015-01-20
- Inventor: Carmelo Engracia Baquiano , Carmelo Delovino Cayaban , Paul Francis Brosas Montalbo , Joseph Estorgio Celocia
- Applicant: Carmelo Engracia Baquiano , Carmelo Delovino Cayaban , Paul Francis Brosas Montalbo , Joseph Estorgio Celocia
- Applicant Address: US AZ Tempe
- Assignee: Emerson Network Power—Embedded Computing, Inc.
- Current Assignee: Emerson Network Power—Embedded Computing, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G05D23/19 ; H05K1/18
Abstract:
A circuit board assembly including a heating device operated during cold boot startup includes a circuit board having a computer component. A thermal transfer device connected to the circuit board assembly acts when the computer component is operating to remove heat generated by the computer component. A heating device operates to heat the thermal transfer device. A field programmable gate array acts to energize the heating device when a temperature defining a cold startup condition at the computer component or the thermal transfer device is sensed. The thermal transfer device when heated by the heating device heats the computer component to greater than the temperature of the cold startup condition. A control device connected to the heating device provides an operational mode of the heating device.
Public/Granted literature
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