Invention Grant
US08941161B2 Semiconductor device including finFET and diode having reduced defects in depletion region
有权
包括finFET和二极管的半导体器件具有减少的缺陷区域的缺陷
- Patent Title: Semiconductor device including finFET and diode having reduced defects in depletion region
- Patent Title (中): 包括finFET和二极管的半导体器件具有减少的缺陷区域的缺陷
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Application No.: US13888680Application Date: 2013-05-07
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Publication No.: US08941161B2Publication Date: 2015-01-27
- Inventor: Veeraraghavan S. Basker , Tenko Yamashita
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device comprises a first substrate portion and a second substrate portion disposed a distance away from the first substrate portion. The first substrate portion includes a first active semiconductor layer defining at least one semiconductor fin and a first polycrystalline layer formed directly on the fin. The first polycrystalline layer is patterned to define at least one semiconductor gate. The second substrate portion includes a doped region interposed between a second active semiconductor region and an oxide layer. The oxide layer protects the second active semiconductor region and the doped region. The doped region includes a first doped area and a second doped area separated by the first doped region to define a depletion region.
Public/Granted literature
- US20140332815A1 SEMICONDUCTOR DEVICE INCLUDING FINFET AND DIODE HAVING REDUCED DEFECTS IN DEPLETION REGION Public/Granted day:2014-11-13
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