Invention Grant
- Patent Title: Coil unit, substrate unit and power supply device
- Patent Title (中): 线圈单元,基板单元和电源装置
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Application No.: US13866571Application Date: 2013-04-19
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Publication No.: US08941458B2Publication Date: 2015-01-27
- Inventor: Yasuhiro Hara , Masaki Sato , Torao Misono , Wataru Nakahori , Haruhiko Sanae
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-097992 20120423
- Main IPC: H01F5/00
- IPC: H01F5/00

Abstract:
In the coil unit 1A of the power supply device 1, the U-shaped plate 51C constituting the U-shaped terminal 50 is used to electrically connect the print-coil substrates 30, 40. Further, the print-coil substrates 30, 40 constituting the coil unit 1A can be connected to the main circuit substrate 20 also by using the U-shaped terminal 50. Here, the print-coil substrate 30 is connected to the print-coil substrate 40 by using the U-shaped terminal 50, by which soldering for fixing the U-shaped terminal 50 is performed from the lower face side of the print-coil substrate 30. Therefore, as compared with a conventional constitution where soldering is performed from both sides of the stacked print-coil substrates, the print coils can be connected by soldering only from one side face, thus making it possible to reduce the amount of work necessary for connecting the print coils.
Public/Granted literature
- US20130278373A1 COIL UNIT, SUBSTRATE UNIT AND POWER SUPPLY DEVICE Public/Granted day:2013-10-24
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