Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
- Patent Title (中): 基板加工装置及基板处理方法
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Application No.: US12644700Application Date: 2009-12-22
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Publication No.: US08941809B2Publication Date: 2015-01-27
- Inventor: Masashi Kanaoka
- Applicant: Masashi Kanaoka
- Applicant Address: JP
- Assignee: SCREEN Semiconductor Solutions Co., Ltd.
- Current Assignee: SCREEN Semiconductor Solutions Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2008-324938 20081222; JP2008-324939 20081222
- Main IPC: G03B27/42
- IPC: G03B27/42 ; H01L21/67
Abstract:
A substrate processing apparatus includes an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block includes first and second inspection units. The first inspection unit inspects the state of the substrate before exposure processing, and the second inspection unit inspects the state of the substrate after exposure processing.
Public/Granted literature
- US20100159372A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2010-06-24
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