Invention Grant
- Patent Title: Multilayer ceramic electronic component and method of manufacturing the same
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: US13620559Application Date: 2012-09-14
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Publication No.: US08941973B2Publication Date: 2015-01-27
- Inventor: Jong Han Kim , Jae Man Park
- Applicant: Jong Han Kim , Jae Man Park
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0043979 20120426
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G7/00

Abstract:
There are provided a multilayer ceramic electronic component and a manufacturing method thereof, the multilayer ceramic electronic component including: a ceramic body including dielectric layers; a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein a thickness to of the internal electrode satisfies 0.1 μm≦Te≦0.5 μm, and when, in a cross-section of the ceramic body taken in length and thickness directions, cut through a central portion of the ceramic body in a width direction, a distance, in the length direction, of a central portion of an internal electrode grain closest to a disconnected portion of the internal electrode is denoted by Tc, and a distance, in the length direction, of the internal electrode grain at a point equal to 25% of the thickness thereof above or below the central portion thereof is denoted by Tl, 0.7≦Tl/Tc≦1.3 is satisfied.
Public/Granted literature
- US20130286538A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-10-31
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