Invention Grant
- Patent Title: Method for gold removal from electronic components
- Patent Title (中): 从电子零件中去除金的方法
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Application No.: US13793846Application Date: 2013-03-11
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Publication No.: US08943662B2Publication Date: 2015-02-03
- Inventor: Paul B. Hafeli , Eli Holzman , Aaron J. Stein , Michael Vargas
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Burns & Levinson LLP
- Agent Joseph M. Maraia
- Main IPC: B23P6/00
- IPC: B23P6/00 ; B23K31/02 ; B23K1/00 ; B23K1/20 ; H05K3/34 ; H05K3/22
Abstract:
In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.
Public/Granted literature
- US20130186942A1 GOLD REMOVAL FROM ELECTRONIC COMPONENTS Public/Granted day:2013-07-25
Information query
