Invention Grant
US08943680B2 Electronic component manufacturing apparatus with opposing plates for holding electronic component during movement
有权
电子部件制造装置，具有用于在运动期间保持电子部件的相对板
- Patent Title: Electronic component manufacturing apparatus with opposing plates for holding electronic component during movement
- Patent Title (中): 电子部件制造装置，具有用于在运动期间保持电子部件的相对板
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Application No.: US13338339Application Date: 2011-12-28
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Publication No.: US08943680B2Publication Date: 2015-02-03
- Inventor: Katsunori Ogata , Miyuki Mizukami
- Applicant: Katsunori Ogata , Miyuki Mizukami
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-294525 20101229
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H01G13/00 ; H01G4/232 ; H01G4/30
Abstract:
An electronic component manufacturing apparatus includes a first plate and a second plate such that a first surface of an electronic component chip is in contact with a first elastic layer of the first plate and a second surface of the electronic component chip is in contact with a second elastic layer of the second plate. The electronic component manufacturing apparatus further includes a planar movement mechanism configured to relatively move the first and second plates in a planar direction thereof and a vertical movement mechanism configured to move, in conjunction with the planar movement mechanism, the first and second plates in accordance with a turning path of the electronic component chip.
Public/Granted literature
- US20120171001A1 ELECTRONIC COMPONENT MANUFACTURING APPARATUS AND ELECTRONIC COMPONENT MANUFACTURING METHOD Public/Granted day:2012-07-05
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