Invention Grant
- Patent Title: Method for manufacturing substrate for liquid ejection head and method for manufacturing liquid ejection head
- Patent Title (中): 液体喷射头用基板的制造方法及液体喷射头的制造方法
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Application No.: US13216069Application Date: 2011-08-23
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Publication No.: US08943690B2Publication Date: 2015-02-03
- Inventor: Yuzuru Ishida , Takuya Hatsui , Kazuaki Shibata , Takeru Yasuda , Ryoji Oohashi , Yoshiyuki Imanaka , Koichi Omata , Hideo Tamura , Kousuke Kubo , Yuji Tamaru
- Applicant: Yuzuru Ishida , Takuya Hatsui , Kazuaki Shibata , Takeru Yasuda , Ryoji Oohashi , Yoshiyuki Imanaka , Koichi Omata , Hideo Tamura , Kousuke Kubo , Yuji Tamaru
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc IP Division
- Priority: JP2010-189512 20100826
- Main IPC: B21D53/76
- IPC: B21D53/76 ; B23P17/00 ; B41J2/14 ; B41J2/16

Abstract:
When protective portions are independently provided for each energy generation element, a leakage current inspection between the protective portions and the energy generation elements cannot be performed at once. Therefore, there is a concern that the inspection in manufacturing a substrate for liquid ejection head requires time. Therefore, the substrate for liquid ejection head is manufactured by performing a leakage current inspection between a connecting portion that is electrically connected to plurality of protective portions and a terminal to which the plurality of energy generation elements are connected, and thereafter removing the connecting portion.
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