Invention Grant
- Patent Title: Weight material dispensing, cutting, and applying system
- Patent Title (中): 重量材料分配,切割和应用系统
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Application No.: US13175413Application Date: 2011-07-01
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Publication No.: US08943940B2Publication Date: 2015-02-03
- Inventor: Louis R. Hedtke, Jr. , Matthew W. King , Scott R. Claxton , Mark A. Compton , David L. McDole , John K. Funcheon , Mark R. Gabel , Ben D. Belknap
- Applicant: Louis R. Hedtke, Jr. , Matthew W. King , Scott R. Claxton , Mark A. Compton , David L. McDole , John K. Funcheon , Mark R. Gabel , Ben D. Belknap
- Applicant Address: US MI Auburn Hills US MN Saint Paul
- Assignee: Esys Corporation,3M Innovative Properties Company
- Current Assignee: Esys Corporation,3M Innovative Properties Company
- Current Assignee Address: US MI Auburn Hills US MN Saint Paul
- Agency: Harness, Dickey & Pierce, PLC
- Main IPC: B26D5/20
- IPC: B26D5/20 ; G01M1/16 ; B26D7/30 ; G01M1/32 ; B26D7/18 ; B26D7/06 ; B26D3/08 ; B26D1/08

Abstract:
An apparatus for balancing a wheel includes a tool and an arm control module. The tool is mechanically coupled to an arm and includes a leading edge, a trailing edge, and a face surface that forms an arc between the leading and trailing edges. The arm control module actuates the arm to position the leading edge of the tool a predetermined distance from an edge of a deck of a cutting apparatus to receive a piece of non-segmented wheel weight material. A blade of a cutting apparatus passes between the edge of the deck and the leading edge of the tool to cut the piece from the non-segmented wheel weight material.
Public/Granted literature
- US20110283790A1 Weight Material Dispensing, Cutting, And Applying System Public/Granted day:2011-11-24
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