Invention Grant
- Patent Title: Modular surface mountable enclosure
- Patent Title (中): 模块化表面可安装外壳
-
Application No.: US13892964Application Date: 2013-05-13
-
Publication No.: US08943978B2Publication Date: 2015-02-03
- Inventor: Matthew Soper , Osbaldo Rodriguez , Davy Nget
- Applicant: RGB Systems, Inc.
- Applicant Address: US CA Anaheim
- Assignee: RGB Systems, Inc.
- Current Assignee: RGB Systems, Inc.
- Current Assignee Address: US CA Anaheim
- Agency: The Hecker Law Group, PLC
- Main IPC: A47B23/00
- IPC: A47B23/00 ; A47B21/06

Abstract:
A modular, customizable, versatile, easy to use, easy to install, aesthetically pleasing surface mountable enclosure is presented. In one or more embodiments, the enclosure includes a modular housing that is configured to be gangable with one or more other housings to provide a range of sizes and configurations. In one or more embodiments, the modular housing is configured to accept a variety of interchangeable cassettes or modules that provide a variety of cable and power connections or other resources. In one or more embodiments, the modular housing includes an articulating lid mechanism that is configured to smoothly open and slide neatly out of the way while occupying a reduced volume than the lid mechanisms of the prior art. In one or more embodiments, the enclosure includes cam driven mounting clamps that allow the enclosure to be quickly and easily secured to a table top or other mounting surface.
Public/Granted literature
- US20140265753A1 MODULAR SURFACE MOUNTABLE ENCLOSURE Public/Granted day:2014-09-18
Information query