A diaper manufacturing apparatus according to the present invention includes: an oscillating mechanism disposed on a top-sheet continuous body while oscillating leg gathers; an outer holding mechanism holding the leg gathers disposed in a predetermined waveform by the oscillating mechanism; and a cutting mechanism having a blade section cutting the leg gathers held by the outer holding mechanism. The outer holding mechanism holds, out of a region formed in a predetermined waveform, an outer end region OT which includes an outer end of the leg gathers and on which an adhesive is not applied. The blade section is disposed inside, relative to a crossing direction, the outer end region OT held by the outer holding mechanism.