Invention Grant
- Patent Title: Modular, fluid thermal transfer device
- Patent Title (中): 模块化流体热转印装置
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Application No.: US13117098Application Date: 2011-05-26
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Publication No.: US08944146B2Publication Date: 2015-02-03
- Inventor: Robert P. Barmore
- Applicant: Robert P. Barmore
- Applicant Address: US NH Portsmouth
- Assignee: Therma-Hexx Corporation
- Current Assignee: Therma-Hexx Corporation
- Current Assignee Address: US NH Portsmouth
- Agency: Workman Nydegger
- Main IPC: F24H3/00
- IPC: F24H3/00 ; F25B29/00 ; F28F3/12 ; F24J2/00 ; E04B9/04 ; F24J2/04 ; E04C2/52

Abstract:
A modular thermal panel comprising a paver having a top and bottom surface, and a heat exchanger having connected top and bottom panels with channels formed there between for receiving a heat exchange fluid. The top panel of the heat exchanger is coupled to the bottom surface of the thermal mass unit, an insulator panel is coupled to the bottom panel of the heat exchanger, and inlet and outlet tubes are coupled to the heat exchanger for feeding heat exchange fluid to and from the heat exchanger. The size of the heat exchanger is substantially equal to the size of the paver and the edges of the heat exchanger are substantially aligned with the edges of the paver. The heat exchanger is made of thermally transmissive material including polymers, stainless steel, aluminum, or copper and the thermal mass unit is made of a material which includes modular or pre-formed or formed in place concrete, cement, gypsum concrete, or stone.
Public/Granted literature
- US20120298331A1 Modular, Fluid Thermal Transfer Device Public/Granted day:2012-11-29
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