Invention Grant
- Patent Title: Wire clamp for a wiring device
- Patent Title (中): 接线装置的线夹
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Application No.: US13701166Application Date: 2010-06-01
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Publication No.: US08944859B2Publication Date: 2015-02-03
- Inventor: Michael Kamor , Adam Kevelos
- Applicant: Michael Kamor , Adam Kevelos
- Applicant Address: US NY Melville
- Assignee: Leviton Manufacturing Company, Inc.
- Current Assignee: Leviton Manufacturing Company, Inc.
- Current Assignee Address: US NY Melville
- Agency: Carter, DeLuca, Farrell & Schmidt, LLP
- International Application: PCT/US2010/001612 WO 20100601
- International Announcement: WO2011/152811 WO 20111208
- Main IPC: H01R4/38
- IPC: H01R4/38 ; H01R11/14 ; H01R4/30 ; H01R4/44 ; H01R13/629 ; H01R13/64 ; H01R4/34 ; H01R4/42

Abstract:
A wire clamp is presented including a body having a face surface and an opposing back surface; a front end, a back end, and side ends; at least one tab positioned on an edge of the back end and an opening disposed substantially centrally on the body, the opening extending from the face surface to the back surface. The wire clamp also includes a plurality of gripping members positioned on edges of the side ends and a raised ridge extending a width of the clamp, the raised ridge adapted to grip a wire.
Public/Granted literature
- US20130122759A1 WIRE CLAMP FOR A WIRING DEVICE Public/Granted day:2013-05-16
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