An apparatus, system, and method are provided for venting an enclosure, such as a chassis housing electronic equipment. The method includes receiving, at least one air directing surface, airflow moving in a first direction, the at least one air directing surface being disposed externally from the chassis at a predetermined placement relative to the at least one ventilation surface in a path of the airflow. The at least one air directing surface has a configuration to alter the direction of the airflow between the air directing surface and the at least one ventilation surface. The method also includes redirecting the airflow between the at least one air directing surface and the at least one ventilation surface to at least a second direction using the air directing surface. The predetermined placement and configuration of the at least one air directing surface determine the second direction in which the airflow is discharged, and the second direction is either towards or away from the at least one ventilation surface. Also in the receiving, the airflow is received at least one air directing surface of a bracket configured to attach the chassis to a mounting structure.