Invention Grant
- Patent Title: Instrument for modular orthopaedic prosthesis
- Patent Title (中): 模块化矫形假体仪器
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Application No.: US11529887Application Date: 2006-09-29
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Publication No.: US08945138B2Publication Date: 2015-02-03
- Inventor: Conrad L. Klotz , Chad L. Baughman , Daniel J. Williman
- Applicant: Conrad L. Klotz , Chad L. Baughman , Daniel J. Williman
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, LLC
- Current Assignee: DePuy Synthes Products, LLC
- Current Assignee Address: US MA Raynham
- Agency: Maginot, Moore & Beck LLP
- Main IPC: A61B17/58
- IPC: A61B17/58 ; A61F2/46 ; A61F2/40

Abstract:
A kit for use in performing a trail reduction in joint arthroplasty is provided. The kit includes a trail stem assembly including a first component, a second component selectably moveable with respect to the first component, and a fastener for securing the first component to the second component. The kit also includes an articulating trial component removeably fixedly secured to the trail stem assembly and a driver for cooperation with the fastener to secure the first component to the second component. The kit also includes a handle. The handle has a first feature for permitting the driver to pass through the handle and a second feature for orientably connecting the handle to the articulating trial component.
Public/Granted literature
- US20080161823A1 Instrument for modular orthopaedic prosthesis Public/Granted day:2008-07-03
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