Invention Grant
- Patent Title: Plasma processing apparatus, and maintenance method and assembling method of the same
- Patent Title (中): 等离子体处理装置及其维护方法及组装方法
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Application No.: US12705141Application Date: 2010-02-12
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Publication No.: US08945340B2Publication Date: 2015-02-03
- Inventor: Masashi Saito
- Applicant: Masashi Saito
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2009-030459 20090212
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306 ; H01J37/32
Abstract:
A plasma processing apparatus includes a processing chamber that converts a processing gas introduced from a gas supply source into plasma and performs plasma processing on a target object, an exhaust chamber that communicates with the inside of the processing chamber to exhaust a gas converted into plasma from the processing chamber, and a blocking cover that is provided in the exhaust chamber to block communication between the inside of the processing chamber and the inside of the exhaust chamber.
Public/Granted literature
- US20100204810A1 PLASMA PROCESSING APPARATUS, AND MAINTENANCE METHOD AND ASSEMBLING METHOD OF THE SAME Public/Granted day:2010-08-12
Information query
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