Invention Grant
US08945342B2 Surface wave plasma generating antenna and surface wave plasma processing apparatus
有权
表面波等离子体产生天线和表面波等离子体处理装置
- Patent Title: Surface wave plasma generating antenna and surface wave plasma processing apparatus
- Patent Title (中): 表面波等离子体产生天线和表面波等离子体处理装置
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Application No.: US13410957Application Date: 2012-03-02
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Publication No.: US08945342B2Publication Date: 2015-02-03
- Inventor: Taro Ikeda , Shigeru Kasai , Yuki Osada
- Applicant: Taro Ikeda , Shigeru Kasai , Yuki Osada
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-045413 20110302
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306 ; H01J37/32 ; C23C16/27
Abstract:
A surface wave plasma generating antenna serves to generate a surface wave plasma in a chamber by radiating into the chamber a microwave transmitted from a microwave output section through a coaxial waveguide including an outer conductor and an inner conductor. The surface wave plasma generating antenna is formed in a planar shape and has a plurality of slots arranged in a circumferential direction, and each joint portion between two adjacent slots in the circumferential direction is overlapped with at least one of the slots in a diametrical direction.
Public/Granted literature
- US20120222816A1 SURFACE WAVE PLASMA GENERATING ANTENNA AND SURFACE WAVE PLASMA PROCESSING APPARATUS Public/Granted day:2012-09-06
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