Invention Grant
- Patent Title: Systems and methods of separating bonded wafers
- Patent Title (中): 分离粘结晶片的系统和方法
-
Application No.: US13554751Application Date: 2012-07-20
-
Publication No.: US08945344B2Publication Date: 2015-02-03
- Inventor: Xin-Hua Huang , Ping-Yin Liu , Hung-Hua Lin , Yuan-Chih Hsieh , Lan-Lin Chao , Chia-Shiung Tsai
- Applicant: Xin-Hua Huang , Ping-Yin Liu , Hung-Hua Lin , Yuan-Chih Hsieh , Lan-Lin Chao , Chia-Shiung Tsai
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: B32B38/10
- IPC: B32B38/10
Abstract:
Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.
Public/Granted literature
- US20140020818A1 Systems and Methods of Separating Bonded Wafers Public/Granted day:2014-01-23
Information query
