Invention Grant
- Patent Title: Plating method
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Application No.: US12319753Application Date: 2009-01-12
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Publication No.: US08945362B2Publication Date: 2015-02-03
- Inventor: Jacek M. Knop , John G. Carter , Donald E. Cleary
- Applicant: Jacek M. Knop , John G. Carter , Donald E. Cleary
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agent John J. Piskorski
- Main IPC: C25D21/18
- IPC: C25D21/18 ; C25D5/18 ; H05K3/42
Abstract:
Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
Public/Granted literature
- US20090188804A1 Plating method Public/Granted day:2009-07-30
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