Invention Grant
- Patent Title: Conductive paste and electronic part equipped with electrode wiring formed from same
- Patent Title (中): 导电膏和电子部件配备有由其形成的电极布线
-
Application No.: US13203876Application Date: 2009-03-27
-
Publication No.: US08945436B2Publication Date: 2015-02-03
- Inventor: Takuya Aoyagi , Takashi Naito , Hiroki Yamamoto , Takahiko Kato
- Applicant: Takuya Aoyagi , Takashi Naito , Hiroki Yamamoto , Takahiko Kato
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- International Application: PCT/JP2009/001403 WO 20090327
- International Announcement: WO2010/109541 WO 20100930
- Main IPC: H01B1/22
- IPC: H01B1/22 ; H01L31/0224 ; H01B1/16 ; H01J11/22 ; H01L31/0352 ; H01L31/068

Abstract:
Provided is a conductive paste which contains an inexpensive metal, such as copper or aluminum, as an electrode wiring material and has oxidation resistance that enables the paste to withstand a high-temperature process performed in an oxidizing atmosphere and an electronic part equipped with electrode wiring formed from the paste. The electronic part in accordance with the present invention is equipped with electrode wiring that comprises a conductive glass phase containing transition metals and phosphorus, metal particles, and none of the substances prohibited by the RoHS directive. The electronic part is characterized in that each of the transition metals contained in the conductive glass phase is present in the state of having a plurality of oxidation numbers and that the proportion of the atoms which have the largest oxidation number for each transition metal satisfies a given relationship.
Public/Granted literature
- US20110315937A1 CONDUCTIVE PASTE AND ELECTRONIC PART EQUIPPED WITH ELECTRODE WIRING FORMED FROM SAME Public/Granted day:2011-12-29
Information query