Invention Grant
- Patent Title: Composite material for heat dissipating plate and method of production of same
- Patent Title (中): 散热片用复合材料及其制造方法
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Application No.: US14112956Application Date: 2012-07-11
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Publication No.: US08945466B2Publication Date: 2015-02-03
- Inventor: Kaoru Ishido , Hideki Ishii , Shigehisa Watanabe , Hisashi Hori
- Applicant: Kaoru Ishido , Hideki Ishii , Shigehisa Watanabe , Hisashi Hori
- Applicant Address: JP Tokyo
- Assignee: Nippon Light Metal Company, Ltd.
- Current Assignee: Nippon Light Metal Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Hammer & Associates, P.C.
- Priority: JP2011-156819 20110715
- International Application: PCT/JP2012/004490 WO 20120711
- International Announcement: WO2013/011668 WO 20130124
- Main IPC: B22F3/10
- IPC: B22F3/10 ; B22F3/17 ; B22D19/14 ; C22C1/04 ; C22C1/10 ; C22C21/00 ; C22C21/02 ; H01L23/373

Abstract:
There is provided a composite material for a heat dissipating plate which achieves both a high thermal conductivity and a low coefficient of thermal expansion and has a performance satisfactory as a heat dissipating plate and a method of production of a composite material which can produce the composite material at a low cost. For this reason, powder metallurgy is used to produce the composite material for a heat dissipating plate. The composite material for a heat dissipating plate which is fabricated by this method of production contains an aluminum alloy and silicon carbide. The particles of silicon carbide are in contact with each other.
Public/Granted literature
- US20140037934A1 COMPOSITE MATERIAL FOR HEAT DISSIPATING PLATE AND METHOD OF PRODUCTION OF SAME Public/Granted day:2014-02-06
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