Invention Grant
- Patent Title: Polymeric materials in self-assembled arrays and semiconductor structures comprising polymeric materials
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Application No.: US13928746Application Date: 2013-06-27
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Publication No.: US08945700B2Publication Date: 2015-02-03
- Inventor: Dan B. Millward , Donald L. Westmoreland
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L29/06 ; B81C1/00 ; B82Y30/00
Abstract:
Methods for fabricating sublithographic, nanoscale microstructures in line arrays utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. Semiconductor structures may include self-assembled block copolymer materials in the form of lines of half-cylinders of a minority block matrix of a majority block of the block copolymer. The lines of half-cylinders may be within trenches in the semiconductor structures.
Public/Granted literature
- US08993088B2 Polymeric materials in self-assembled arrays and semiconductor structures comprising polymeric materials Public/Granted day:2015-03-31
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