An ethylene resin composition is provided which has excellent properties including adhesion properties, electrically insulating properties, transparency, moldability and process stability and can be produced without requiring any cross-linking procedure if necessary to improve productivity; and others. The ethylene resin composition contains a modified product produced by modifying an ethylene polymer (A) that meets all of the requirements a) to e) mentioned below with an ethylenically unsaturated silane compound (B). a) The density is 900 to 940 kg/m3. b) The melting peak temperature is 90 to 125 ° C. as determined by DSC. c) The melt flow rate (MFR2) is 0.1 to 100 g/10 minutes as measured at 190 ° C. and a load of 2.16 kg in accordance with JIS K-6721. d) The Mw/Mn ratio is 1.2 to 3.5. e) The content of metal residues is 0.1 to 50 ppm.