Invention Grant
- Patent Title: Lead frame and manufacturing method thereof
- Patent Title (中): 引线框架及其制造方法
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Application No.: US13062245Application Date: 2009-09-07
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Publication No.: US08945951B2Publication Date: 2015-02-03
- Inventor: Chang Hwa Park , Eun Jin Kim , Jin Young Son , Kyoung Taek Park , In Kuk Cho
- Applicant: Chang Hwa Park , Eun Jin Kim , Jin Young Son , Kyoung Taek Park , In Kuk Cho
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2008-0087689 20080905
- International Application: PCT/KR2009/005057 WO 20090907
- International Announcement: WO2010/027231 WO 20100311
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495
Abstract:
Disclosed are a lead frame and a method for manufacturing the same. The lead frame includes a copper substrate and a rough copper layer having surface roughness of 110 nm to 300 nm on a surface of the copper substrate.
Public/Granted literature
- US20110272184A1 LEAD FRAME AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-11-10
Information query
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