Invention Grant
- Patent Title: Formation of metal structures in solar cells
- Patent Title (中): 太阳能电池中金属结构的形成
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Application No.: US13931520Application Date: 2013-06-28
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Publication No.: US08945978B2Publication Date: 2015-02-03
- Inventor: Joseph Frederick Behnke
- Applicant: SunPower Corporation
- Applicant Address: US CA San Jose
- Assignee: SunPower Corporation
- Current Assignee: SunPower Corporation
- Current Assignee Address: US CA San Jose
- Agency: Okamoto & Benedicto LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/302 ; H01L21/461 ; H01L21/31 ; H01L21/469 ; H01L31/18
Abstract:
A metal contact of a solar cell is formed by electroplating copper using an electroplating seed that is formed on a dielectric layer. The electroplating seed includes an aluminum layer that connects to a diffusion region of the solar cell through a contact hole in the dielectric layer. A nickel layer is formed on the aluminum layer, with the nickel layer-aluminum layer stack forming the electroplating seed. The copper is electroplated in a copper plating bath that has methanesulfonic acid instead of sulfuric acid as the supporting electrolyte.
Public/Granted literature
- US20150004744A1 FORMATION OF METAL STRUCTURES IN SOLAR CELLS Public/Granted day:2015-01-01
Information query
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