Invention Grant
US08945992B2 Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package
有权
功率器件封装包括金属片裸片附着片（DAP）和制造封装的方法
- Patent Title: Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package
- Patent Title (中): 功率器件封装包括金属片裸片附着片（DAP）和制造封装的方法
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Application No.: US13278664Application Date: 2011-10-21
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Publication No.: US08945992B2Publication Date: 2015-02-03
- Inventor: Joon-seo Son , O-seob Jeon , Taek-keun Lee , Byoung-ok Lee
- Applicant: Joon-seo Son , O-seob Jeon , Taek-keun Lee , Byoung-ok Lee
- Applicant Address: KR Bucheon-si
- Assignee: Fairchild Korea Semiconductor, Ltd.
- Current Assignee: Fairchild Korea Semiconductor, Ltd.
- Current Assignee Address: KR Bucheon-si
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Priority: KR10-2007-0002184 20070108
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495 ; H01L23/00
Abstract:
A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor power device die and the lead frame. In addition the power device package substantially prevents impurities from penetrating into the power device package by increasing the surface creepage distance of a sealant resulting from the metal tab DAP and an optional swaging of the lead frame.
Public/Granted literature
- US20120034741A1 POWER DEVICE PACKAGE COMPRISING METAL TAB DIE ATTACH PADDLE (DAP) AND METHOD OF FABRICATING THE PACKAGE Public/Granted day:2012-02-09
Information query
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