Invention Grant
US08946053B2 Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate
有权
用于减少从源极衬底转移到玻璃基支撑衬底的层的表面的不规则性的方法
- Patent Title: Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate
- Patent Title (中): 用于减少从源极衬底转移到玻璃基支撑衬底的层的表面的不规则性的方法
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Application No.: US13702062Application Date: 2011-06-20
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Publication No.: US08946053B2Publication Date: 2015-02-03
- Inventor: Daniel Delprat , Carine Duret , Nadia Ben-Mohamed , Fabrice Lallement
- Applicant: Daniel Delprat , Carine Duret , Nadia Ben-Mohamed , Fabrice Lallement
- Applicant Address: FR Bernin
- Assignee: Soitec
- Current Assignee: Soitec
- Current Assignee Address: FR Bernin
- Agency: TraskBritt
- Priority: FR1061302 20101228
- International Application: PCT/EP2011/060251 WO 20110620
- International Announcement: WO2012/000821 WO 20120105
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L21/762 ; H01L21/18
Abstract:
A method for reducing irregularities at a surface of a layer transferred from a source substrate to a glass-based support substrate, by generating a weakening zone in the source substrate; contacting the source substrate and the glass-based support substrate; and splitting the source substrate at the weakening zone; wherein the glass-based substrate has a thickness of between 300 μm and 600 μm.
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