Invention Grant
- Patent Title: No-flow underfill for package with interposer frame
- Patent Title (中): 带内插架的封装的无流动底部填充
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Application No.: US13536905Application Date: 2012-06-28
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Publication No.: US08946072B2Publication Date: 2015-02-03
- Inventor: Jiun Yi Wu
- Applicant: Jiun Yi Wu
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L23/488
Abstract:
Mechanisms of forming a package on package (PoP) package by using an interposer and an no-reflow underfill (NUF) layer are provided. The interposer frame improves the form factor of the package, enables the reduction in the pitch of the bonding structures. The NUF layer enables a semiconductor die and an interposer frame be bonded to a substrate by utilizing the heat on the connectors of the semiconductor die and on the connectors of the interposer frame for bonding. The heat provided by the semiconductor die and the interposer frame also transforms the NUF layer into an underfill. PoP structures formed by using the interposer frame and the NUF layer improve yield and have better reliability performance.
Public/Granted literature
- US20130200513A1 NO-FLOW UNDERFILL FOR PACKAGE WITH INTERPOSER FRAME Public/Granted day:2013-08-08
Information query
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