Invention Grant
- Patent Title: Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体构造及其制造方法以及半导体器件及其制造方法
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Application No.: US14271227Application Date: 2014-05-06
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Publication No.: US08946079B2Publication Date: 2015-02-03
- Inventor: Shinji Wakisaka , Takeshi Wakabayashi
- Applicant: Tera Probe, Inc.
- Applicant Address: JP Kanagawa
- Assignee: Tera Probe, Inc.
- Current Assignee: Tera Probe, Inc.
- Current Assignee Address: JP Kanagawa
- Agency: Holtz, Holtz, Goodman & Chick PC
- Priority: JP2009-158618 20090703; JP2009-158622 20090703; JP2009-158629 20090703
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L21/56 ; H01L23/50 ; H01L21/683 ; H01L23/538 ; H01L23/00 ; H01L23/28 ; H01L23/31 ; H01L23/498 ; H01L23/525
Abstract:
A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring.
Public/Granted literature
Information query
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