Semiconductor process and structure

Invention Grant

US08946085B2 Semiconductor process and structure 有权

Title translation: 半导体工艺及结构

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Patent Title: Semiconductor process and structure
Patent Title (中): 半导体工艺及结构
Application No.: US12774823

Application Date: 2010-05-06
Publication No.: US08946085B2

Publication Date: 2015-02-03
Inventor: Wen-Hsiung Chang
Applicant: Wen-Hsiung Chang
Applicant Address: US DE Wilmington
Assignee: Ineffable Cellular Limited Liability Company
Current Assignee: Ineffable Cellular Limited Liability Company
Current Assignee Address: US DE Wilmington
Main IPC: H01L29/72
IPC: H01L29/72 ; H01L21/768

Abstract:

A semiconductor process includes the following steps. Firstly, a conductive substrate is provided. Then, at least one insulating pattern is formed on the conductive substrate. Thereafter at least one metal pattern is formed on the insulating pattern. After that, a passivation layer is formed on the conductive substrate to cover the metal pattern by an electroplating process.

Abstract(Chinese):

半导体工艺包括以下步骤。首先，提供导电性基板。然后，在导电基板上形成至少一个绝缘图案。此后，在绝缘图案上形成至少一个金属图案。之后，在导电基板上形成钝化层，以通过电镀工艺覆盖金属图案。

Public/Granted literature

US20110272808A1 SEMICONDUCTOR PROCESS AND STRUCTURE Public/Granted day:2011-11-10

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L29/66	.按半导体器件的类型区分的
H01L29/68	..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的（H01L29/96优先）
H01L29/70	...双极器件
H01L29/72	....晶体管型器件，如连续响应于所施加的控制信号的