Invention Grant
- Patent Title: Electroless copper deposition
- Patent Title (中): 无电镀铜沉积
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Application No.: US13364924Application Date: 2012-02-02
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Publication No.: US08946087B2Publication Date: 2015-02-03
- Inventor: Praveen Reddy Nalla
- Applicant: Praveen Reddy Nalla
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Beyer Law Group LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/4763 ; H01L21/20 ; H01L29/40
Abstract:
A method for providing metal filled features in a layer is provided. A metal seed layer is deposited on tops and bottoms of the features. Metal seed layer on tops of the features and overhangs is removed without removing metal seed layer on bottoms of features. An electroless deposition of metal is provided to fill the features, wherein the electroless deposition first deposits on the metal seed layer on bottoms of the features.
Public/Granted literature
- US20130203249A1 ELECTROLESS COPPER DEPOSITION Public/Granted day:2013-08-08
Information query
IPC分类:
