Invention Grant
US08946093B2 Imprint method, imprint apparatus, and method of manufacturing semiconductor device
有权
压印方法，压印装置和制造半导体器件的方法
- Patent Title: Imprint method, imprint apparatus, and method of manufacturing semiconductor device
- Patent Title (中): 压印方法，压印装置和制造半导体器件的方法
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Application No.: US13421272Application Date: 2012-03-15
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Publication No.: US08946093B2Publication Date: 2015-02-03
- Inventor: Shinji Mikami
- Applicant: Shinji Mikami
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2011-208114 20110922
- Main IPC: H01L21/3105
- IPC: H01L21/3105 ; H01L21/312 ; G03F7/00
Abstract:
In an imprint method of an embodiment, in the imprinting of an imprint shot including an outermost peripheral region of a substrate where resist is not desired to be entered at the time of imprinting, light curing the resist is applied to a light irradiation region with a predetermined width including a boundary between the outermost peripheral region and a pattern formation region more inside than the outermost peripheral region, whereby the resist which is to enter inside the outermost peripheral region is cured. Then, light curing the resist filled in a template pattern is applied onto a template.
Public/Granted literature
- US20130078820A1 IMPRINT METHOD, IMPRINT APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2013-03-28
Information query
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