Invention Grant
US08946098B2 Device for a laser lift-off method and laser lift-off method 有权
激光剥离方法和激光剥离装置

Device for a laser lift-off method and laser lift-off method
Abstract:
A device is intended for a laser lift-off method to sever at least one layer from a carrier. The device includes a laser that generates pulsed laser radiation and at least one beam splitter. The laser radiation is divided into at least two partial beams by the at least one beam splitter. The partial beams are superimposed in an irradiation plane, the irradiation plane being provided such that a major side of the carrier remote from the layer is arranged therein. At the irradiation plane, an angle (α) between the at least two partial beams is at least 1.0°.
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