Invention Grant
- Patent Title: Device for a laser lift-off method and laser lift-off method
- Patent Title (中): 激光剥离方法和激光剥离装置
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Application No.: US13514373Application Date: 2010-10-21
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Publication No.: US08946098B2Publication Date: 2015-02-03
- Inventor: Ralph Wagner
- Applicant: Ralph Wagner
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102009057566 20091209
- International Application: PCT/EP2010/065891 WO 20101021
- International Announcement: WO2011/069735 WO 20110616
- Main IPC: H01L21/26
- IPC: H01L21/26 ; H01L21/324 ; H01L21/42 ; H01L21/477 ; B23K26/06 ; B23K26/067 ; B23K26/073 ; B23K26/36 ; B23K26/40 ; B23K26/00

Abstract:
A device is intended for a laser lift-off method to sever at least one layer from a carrier. The device includes a laser that generates pulsed laser radiation and at least one beam splitter. The laser radiation is divided into at least two partial beams by the at least one beam splitter. The partial beams are superimposed in an irradiation plane, the irradiation plane being provided such that a major side of the carrier remote from the layer is arranged therein. At the irradiation plane, an angle (α) between the at least two partial beams is at least 1.0°.
Public/Granted literature
- US20120258605A1 DEVICE FOR A LASER LIFT-OFF METHOD AND LASER LIFT-OFF METHOD Public/Granted day:2012-10-11
Information query
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