Invention Grant
US08946365B2 Low molecular weight polystyrene resin and methods of making and using the same
有权
低分子量聚苯乙烯树脂及其制备和使用方法
- Patent Title: Low molecular weight polystyrene resin and methods of making and using the same
- Patent Title (中): 低分子量聚苯乙烯树脂及其制备和使用方法
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Application No.: US13740320Application Date: 2013-01-14
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Publication No.: US08946365B2Publication Date: 2015-02-03
- Inventor: Wei Min Cheng , Puthenkovilakom Rajesh Raja , George Joseph Kutsek , John B. Penn
- Applicant: Eastman Chemical Company
- Applicant Address: US TN Kingsport
- Assignee: Eastman Chemical Company
- Current Assignee: Eastman Chemical Company
- Current Assignee Address: US TN Kingsport
- Agent James K. Leonard; Polly C. Owen
- Main IPC: C08F4/00
- IPC: C08F4/00 ; C08F12/02 ; C09J125/06 ; C08F112/08 ; C08F8/04
Abstract:
A low z-average molecular weight, high softening point polystyrene resin having a narrow molecular weight distribution, as well as methods of making and using the same, are provided. The use of an inert solvent and/or the order of addition of reactants during polymerization may contribute to the unique properties of the final homopolymeric resin. The polystyrene resin can be partially or fully hydrogenated and may have particular use as a tackifying agent in a variety of hot melt adhesive and rubber compositions.
Public/Granted literature
- US20130184425A1 LOW MOLECULAR WEIGHT POLYSTYRENE RESIN AND METHODS OF MAKING AND USING THE SAME Public/Granted day:2013-07-18
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