Invention Grant
US08946499B2 Systems, methods and materials for delivery and debonding on demand
有权
用于交付和分离的系统,方法和材料
- Patent Title: Systems, methods and materials for delivery and debonding on demand
- Patent Title (中): 用于交付和分离的系统,方法和材料
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Application No.: US13318187Application Date: 2010-04-27
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Publication No.: US08946499B2Publication Date: 2015-02-03
- Inventor: Pradeep Iyer , Eugene Rozenbaoum , David N. Edwards , Prakash Mallya , Tien Ly
- Applicant: Pradeep Iyer , Eugene Rozenbaoum , David N. Edwards , Prakash Mallya , Tien Ly
- Applicant Address: US CA Glendale
- Assignee: Avery Dennison Corporation
- Current Assignee: Avery Dennison Corporation
- Current Assignee Address: US CA Glendale
- Agency: Avery Dennison Corporation
- International Application: PCT/US2010/032610 WO 20100427
- International Announcement: WO2010/129299 WO 20101111
- Main IPC: A61F13/00
- IPC: A61F13/00

Abstract:
Various systems, methods and materials are disclosed that enable efficient delivery of an agent into an adhesively adhered article, in which the agent elicits a desired outcome, on demand. This strategy, though general in scope, is also more specifically described with regard to enabling painless or atraumatic removal of products adhering to mammalian tissues such as skin and hair by suitably exploiting the ingress of an appropriate agent or like fluid. Other techniques and articles that aid in the handling or removal of such adhesive products are also disclosed.
Public/Granted literature
- US20120123220A1 Systems, Methods and Materials for Delivery and Debonding on Demand Public/Granted day:2012-05-17
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