A pan structure for bonding solar modules installed on a target position is provided. The pan structure includes a plate member configured to be disposed across a spacing between two rail structures for mounting one or more solar modules. Additionally, the pan structure includes a pair of edge members configured to couple the plate member respectively with the two rail structures. Each of the pair of edge members has a first ledge characterized to be electrically conductive and configured to be supported by one of the two rail structures and a second ledge connected the first ledge to the plate member to keep the plate member a distance below the first ledge. Moreover, the pan structure includes a plurality of contact elements spatially distributed along the first ledge for bonding both the one or more solar modules and the rail structures for electric grounding.