Invention Grant
- Patent Title: Laser machining apparatus
- Patent Title (中): 激光加工设备
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Application No.: US13595206Application Date: 2012-08-27
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Publication No.: US08946587B2Publication Date: 2015-02-03
- Inventor: Takuo Kobayashi , Shin Yoshida , Izuru Hori , Masahiro Koike , Kenichi Fukami
- Applicant: Takuo Kobayashi , Shin Yoshida , Izuru Hori , Masahiro Koike , Kenichi Fukami
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2011-230096 20111019
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K26/08 ; B23K26/14 ; B23K37/02 ; B23K26/12
Abstract:
A laser machining apparatus is provided with: a workpiece support unit; a machining head; and a machining head moving unit. The workpiece support unit includes: an end support part that supports a width end of a workpiece; and an inside support part that supports an inside portion of the workpiece in a width direction. The end support part is movable in a longitudinal direction independently from the inside support part in response to a movement of the machining head.
Public/Granted literature
- US20130098876A1 LASER MACHINING APPARATUS Public/Granted day:2013-04-25
Information query
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