Invention Grant
- Patent Title: Semiconductor device and manufacturing method for the same
- Patent Title (中): 半导体器件及其制造方法相同
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Application No.: US13552805Application Date: 2012-07-19
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Publication No.: US08946700B2Publication Date: 2015-02-03
- Inventor: Kengo Akimoto , Junichiro Sakata , Shunpei Yamazaki
- Applicant: Kengo Akimoto , Junichiro Sakata , Shunpei Yamazaki
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2009-242256 20091021
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L27/12

Abstract:
An object is to provide a method for manufacturing a highly reliable semiconductor device including thin film transistors which have stable electric characteristics and are formed using an oxide semiconductor. A method for manufacturing a semiconductor device includes the steps of: forming an oxide semiconductor film over a gate electrode with a gate insulating film interposed between the oxide semiconductor film and the gate electrode, over an insulating surface; forming a first conductive film including at least one of titanium, molybdenum, and tungsten, over the oxide semiconductor film; forming a second conductive film including a metal having lower electronegativity than hydrogen, over the first conductive film; forming a source electrode and a drain electrode by etching of the first conductive film and the second conductive film; and forming an insulating film in contact with the oxide semiconductor film, over the oxide semiconductor film, the source electrode, and the drain electrode.
Public/Granted literature
- US20120280230A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THE SAME Public/Granted day:2012-11-08
Information query
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