Invention Grant
- Patent Title: Epitaxial substrate and method for manufacturing epitaxial substrate
- Patent Title (中): 外延衬底和外延衬底的制造方法
-
Application No.: US13658293Application Date: 2012-10-23
-
Publication No.: US08946723B2Publication Date: 2015-02-03
- Inventor: Makoto Miyoshi , Shigeaki Sumiya , Mikiya Ichimura , Sota Maehara , Mitsuhiro Tanaka
- Applicant: NGK Insulators, Ltd.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2010-103208 20100428; JP2010-202981 20100910
- Main IPC: H01L31/0256
- IPC: H01L31/0256 ; H01L21/02 ; C30B25/18 ; C30B29/40 ; H01L29/04 ; H01L29/15 ; H01L29/20 ; H01L29/205

Abstract:
Provided is a crack-free epitaxial substrate having excellent breakdown voltage properties in which a silicon substrate is used as a base. The epitaxial substrate includes a (111) single crystal Si substrate and a buffer layer including a plurality of first lamination units. Each of those units includes a composition modulation layer formed of a first composition layer made of AlN and a second composition layer made of AlxGa1-xN being alternately laminated, and a first intermediate layer made of AlyGa1-yN (0≦y x(n) is satisfied, where n represents the number of laminations of each of the first and second composition layers, and x(i) represents the value of x in i-th one of the second composition layers as counted from the base substrate side. The second composition layer is coherent to the first composition layer, and the first intermediate layer is coherent to the composition modulation layer.
Public/Granted literature
- US20130043488A1 EPITAXIAL SUBSTRATE AND METHOD FOR MANUFACTURING EPITAXIAL SUBSTRATE Public/Granted day:2013-02-21
Information query
IPC分类: