Invention Grant
- Patent Title: Zinc oxide based compound semiconductor device
- Patent Title (中): 氧化锌基化合物半导体器件
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Application No.: US11886852Application Date: 2006-03-23
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Publication No.: US08946727B2Publication Date: 2015-02-03
- Inventor: Ken Nakahara , Kentaro Tamura
- Applicant: Ken Nakahara , Kentaro Tamura
- Applicant Address: JP Kyoto-shi
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto-shi
- Agency: Rabin & Berdo, P.C.
- Priority: JP2005-086977 20050324
- International Application: PCT/JP2006/305804 WO 20060323
- International Announcement: WO2006/101157 WO 20060928
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L29/221 ; H01L29/04 ; H01L29/225 ; H01L29/778 ; H01L21/02 ; H01L33/16 ; H01L33/28 ; H01S5/042 ; H01S5/22 ; H01S5/223

Abstract:
There is provided a zinc oxide based compound semiconductor device in which drive voltage is not raised, property of crystal is satisfactory and device characteristics is excellent, even when the semiconductor device is formed by forming a lamination portion having a hetero junction of the ZnO based compound semiconductor layers. The zinc oxide based compound semiconductor device includes a substrate (1) made of MgxZn1-xO (0≦x≦0.5), the principal plane of which is a plane A (11-20) or a plane M (10-10), and single crystal layers (2) to (6) made of zinc oxide based compound semiconductor, which are epitaxially grown on the principal plane of the substrate (1) in such orientation that a plane parallel to the principal plane is a plane {11-20} or a plane {10-10} and a plane perpendicular to the principal plane is a plane {0001}.
Public/Granted literature
- US20090034568A1 Zinc Oxide Based Compound Semiconductor Device Public/Granted day:2009-02-05
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