Invention Grant
US08946734B2 Method for packaging light emitting diodes and light emitting module having LED packages formed by the method 有权
用于封装发光二极管的方法和具有通过该方法形成的LED封装的发光模块

Method for packaging light emitting diodes and light emitting module having LED packages formed by the method
Abstract:
A method for making a light emitting module includes: a. providing a flexible substrate; b. forming a plurality of rigid portions in the flexible substrate; c. forming an electrically conductive layer on the rigid portions, the electrically conductive layer having several electrodes apart from each other; d. arranging a plurality of LED dies on the electrically conductive layer with each LED die striding over and electrically connected to two neighboring electrodes; e. forming an encapsulating layer to cover the LED dies; and f. cutting through the flexible substrate. At least one of above steps b, c, d, e is performed by a roll applying process.
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