Invention Grant
US08946734B2 Method for packaging light emitting diodes and light emitting module having LED packages formed by the method
有权
用于封装发光二极管的方法和具有通过该方法形成的LED封装的发光模块
- Patent Title: Method for packaging light emitting diodes and light emitting module having LED packages formed by the method
- Patent Title (中): 用于封装发光二极管的方法和具有通过该方法形成的LED封装的发光模块
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Application No.: US13457553Application Date: 2012-04-27
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Publication No.: US08946734B2Publication Date: 2015-02-03
- Inventor: Hsing-Fen Lo
- Applicant: Hsing-Fen Lo
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110198810 20110715
- Main IPC: H01L33/08
- IPC: H01L33/08 ; H01L33/44 ; H01L33/52 ; H01L25/075

Abstract:
A method for making a light emitting module includes: a. providing a flexible substrate; b. forming a plurality of rigid portions in the flexible substrate; c. forming an electrically conductive layer on the rigid portions, the electrically conductive layer having several electrodes apart from each other; d. arranging a plurality of LED dies on the electrically conductive layer with each LED die striding over and electrically connected to two neighboring electrodes; e. forming an encapsulating layer to cover the LED dies; and f. cutting through the flexible substrate. At least one of above steps b, c, d, e is performed by a roll applying process.
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