Invention Grant
- Patent Title: Light emitting diode and manufacturing method thereof
- Patent Title (中): 发光二极管及其制造方法
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Application No.: US13570214Application Date: 2012-08-08
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Publication No.: US08946737B2Publication Date: 2015-02-03
- Inventor: Ya-Wen Lin , Po-Min Tu , Shih-Cheng Huang , Chia-Hung Huang , Shun-Kuei Yang
- Applicant: Ya-Wen Lin , Po-Min Tu , Shih-Cheng Huang , Chia-Hung Huang , Shun-Kuei Yang
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110443704 20111227
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light emitting diode (LED) includes a substrate, a buffer layer and an epitaxial structure. The substrate has a first surface with a patterning structure formed thereon. The patterning structure includes a plurality of projections. The buffer layer is arranged on the first surface of the substrate. The epitaxial structure is arranged on the buffer layer. The epitaxial structure includes a first semiconductor layer, an active layer and a second semiconductor layer arranged on the buffer layer in sequence. The first semiconductor layer has a second surface attached to the active layer. A distance between a peak of each the projections and the second surface of the first semiconductor layer is ranged from 0.5 μm to 2.5 μm.
Public/Granted literature
- US20130161652A1 LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-06-27
Information query
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