Invention Grant
US08946746B2 Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same
有权
引线，布线部件，封装部件，具有树脂和树脂密封半导体器件的金属部件及其制造方法
- Patent Title: Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same
- Patent Title (中): 引线，布线部件，封装部件，具有树脂和树脂密封半导体器件的金属部件及其制造方法
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Application No.: US13062408Application Date: 2009-12-24
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Publication No.: US08946746B2Publication Date: 2015-02-03
- Inventor: Takahiro Fukunaga , Yasuko Imanishi
- Applicant: Takahiro Fukunaga , Yasuko Imanishi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-330788 20081225
- International Application: PCT/JP2009/007177 WO 20091224
- International Announcement: WO2010/073660 WO 20100701
- Main IPC: H01L33/22
- IPC: H01L33/22 ; C07D487/04 ; C07D249/12 ; C07D251/20 ; C07D251/38 ; C08G61/10 ; C23C28/00 ; H01L23/29 ; H01L23/31 ; H01L23/00
Abstract:
A semiconductor device and manufacturing method therefor, provided with the aims of constraining resin burr formation while having good electric connectivity and joining strength, and LED device, provided with the aim of improving adhesion between silicon resin and leads while having good luminescent characteristics.
Public/Granted literature
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