Invention Grant
- Patent Title: Light emitting diode and light emitting diode package
- Patent Title (中): 发光二极管和发光二极管封装
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Application No.: US13970825Application Date: 2013-08-20
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Publication No.: US08946762B2Publication Date: 2015-02-03
- Inventor: Jongbae Kim , Jong-In Shim , Hyunsung Kim , Il-Gyun Choi
- Applicant: Electronics and Telecommunications Research Institute , Industry-University Cooperation Foundation Hanyang Univ.
- Applicant Address: KR Daejeon KR Gyeonggi-Do
- Assignee: Electronics and Telecommunications Research Institute,Industry-University Cooperation Foundation Hanyang Univ.
- Current Assignee: Electronics and Telecommunications Research Institute,Industry-University Cooperation Foundation Hanyang Univ.
- Current Assignee Address: KR Daejeon KR Gyeonggi-Do
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2012-0090859 20120820; KR10-2013-0010433 20130130
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/62 ; H01L33/38 ; H01L33/20

Abstract:
A light emitting diode includes a first semiconductor layer, an active layer, and a second semiconductor layer sequentially stacked on a substrate, and a first electrode connected to the first semiconductor layer. The first electrode includes an edge electrode including first and second edge portions opposite to each other, and a line electrode including first and second line portions respectively extending from the first and second edge portions. The edge electrode has a closed loop-shape. A distance between the first line portion and the second edge portion is equal to or less than a quarter of a length of the first line portion. A distance between the second line portion and the first edge portion is equal to or less than a quarter of a length of the second line portion.
Public/Granted literature
- US20140048840A1 LIGHT EMITTING DIODE AND LIGHT EMITTING DIODE PACKAGE Public/Granted day:2014-02-20
Information query
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