Invention Grant
- Patent Title: Gallium nitride semiconductor substrate
- Patent Title (中): 氮化镓半导体衬底
-
Application No.: US13861945Application Date: 2013-04-12
-
Publication No.: US08946774B2Publication Date: 2015-02-03
- Inventor: Masaki Ueno
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L29/20 ; C30B25/18 ; H01L33/16

Abstract:
A method of fabricating a single crystal gallium nitride substrate the step of cutting an ingot of single crystal gallium nitride along predetermined planes to make one or more single crystal gallium nitride substrates. The ingot of single crystal gallium nitride is grown by vapor phase epitaxy in a direction of a predetermined axis. Each predetermined plane is inclined to the predetermined axis. Each substrate has a mirror polished primary surface. The primary surface has a first area and a second area. The first area is between an edge of the substrate and a line 3 millimeter away from the edge. The first area surrounds the second area. An axis perpendicular to the primary surface forms an off-angle with c-axis of the substrate. The off-angle takes a minimum value at a first position in the first area of the primary surface.
Public/Granted literature
- US20130292688A1 GALLIUM NITRIDE SEMICONDUCTOR SUBSTRATE WITH SEMICONDUCTOR FILM FORMED THEREIN Public/Granted day:2013-11-07
Information query
IPC分类: