Invention Grant
- Patent Title: Semiconductor device with selectively etched surface passivation
- Patent Title (中): 具有选择性蚀刻表面钝化的半导体器件
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Application No.: US13533610Application Date: 2012-06-26
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Publication No.: US08946776B2Publication Date: 2015-02-03
- Inventor: Bruce M. Green , Darrell G. Hill , Jenn Hwa Huang , Karen E. Moore
- Applicant: Bruce M. Green , Darrell G. Hill , Jenn Hwa Huang , Karen E. Moore
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Lempia Summerfield Katz LLC
- Main IPC: H01L29/812
- IPC: H01L29/812

Abstract:
A semiconductor device includes a semiconductor substrate configured to include a channel, a gate supported by the semiconductor substrate to control current flow through the channel, a first dielectric layer supported by the semiconductor substrate and including an opening in which the gate is disposed, and a second dielectric layer disposed between the first dielectric layer and a surface of the semiconductor substrate in a first area over the channel. The second dielectric layer is patterned such that the first dielectric layer is disposed on the surface of the semiconductor substrate in a second area over the channel.
Public/Granted literature
- US20130341678A1 Semiconductor Device with Selectively Etched Surface Passivation Public/Granted day:2013-12-26
Information query
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